GE IC694ACC310 插槽填充模块 高性能控制系统

【产品详情】

IC695ACC310是一个插槽填充模块，是PACSystem RX3i可编程自动化控制器（PAC）系列的附件组件，以前由GE智能平台公司提供，目前隶属于艾默生自动化。该模块有时称为虚拟模块、插槽盖或空白模块，主要用于保护空置插槽的裸露电子电路免受灰尘和污垢等工业污染物的积累，并防止水、油、油脂和类似污染物的飞溅。此外，槽盖可以防止导电碎屑，例如钻孔操作产生的金属。IC695ACC310覆盖单个空插槽，并且不需要开发正常运行的 PACSystem 配置，因为IC695ACC310不连接到背板。该模块可以在通电下插入和移除，但是，必须特别注意相邻模块，避免相邻模块从相应的插入点上移除。在设计灵活的模块化系统时会产生空位。为了将来的修改和系统升级，留下空位以保留模块的战略安排。此外，IC694ACC310可以安装在任何 PACSystem RX3i 机架或底板上，例如主机架、扩展机架或远程机架。IC694ACC310的安装实例数没有限制。IC694ACC310物理外观和测量是实际 I/O 模块的典型特征，但IC694ACC310插槽填充物没有 LED 状态指示灯和单个通道 LED 指示灯。此插槽盖模块的材料与I/O模块

的材料相同 IC694ACC310模块是空白插槽填充模块。IC694ACC310模块由GE Fanuc制造，用于GE RX3i PacSystem，这是一个可扩展的高性能控制系统，支持PacSystems引擎。该系统基于机架，并根据 PCI 标准构建。RX3i PacSystems 的功能包括用于实时 I/O 控制的 Profinet、用于开发和配置控制功能的 Proficy 机器版软件、用于机器自动化的 PacMotion 控制器以及热备用冗余控制。RX3i Pacsystems 底板提供 16、12 和 7 插槽配置，它们支持热插拔功能，可减少停机时间。扩展底板提供 10 插槽和 5 插槽版本。IC694ACC310模块主要用于美容目的。

GE Fanuc IC694ACC310是GE RX3i PacSystem制造的B型槽填充模块。 GE RX3i PacSystem是一个高性能控制系统，由支持PacSystem引擎的模块组成。这种基于机架的系统基于 PCI 标准构建，可在模块之间提供快速、一致的控制。

空IC694ACC310模块主要用于装饰目的，是GE RX3i PacSystem基于机架的系统上的占位符或填充物。可以在单个机架上使用多个空白插槽填充模块，以构成完整的模块机架。填充模块可用于保护活动模块免受损坏，并防止活动模块在发生撞击或跌落时移出机架。

通过填充机架上的空插槽，如果机架上发生液体划伤或溢出，IC694ACC310可以保护插槽免受损坏。如果单个插槽模块损坏，可以将损坏模块的电子元件从机箱中取出并放入IC694ACC310以恢复完全运行。

GE RX3i PacSystem 中包含的其他模块包括温度控制模块、热电偶、I/O 模块、电阻 I/O 模块、本地和远程 I/O 扩展模块、气动模块、功率测量模块、协处理器通信模块、串行通信模块、应变计 I/O 模块、RTD I/O 模块、毫伏 I/O 模块、模拟混合 I/O 模块（输入和输出）、 用于个人计算系统的离散I/O模块和反射存储器接口模块。

GE IC694ACC310 插槽填充模块 高性能控制系统

【英文介绍】

The IC695ACC310 is a slot-fill module that is an accessory component of the PACSystem RX3i Programmable Automation Controller (PAC) family, formerly provided by GE Intelligent Platforms and now owned by Emerson Automation. Sometimes referred to as a virtual module, slot cover, or blank module, the module is primarily used to protect the bare electronic circuits of vacant slots from the accumulation of industrial contaminants such as dust and dirt, and to prevent splashing of water, oil, grease, and similar contaminants. In addition, the tank cover protects against conductive debris, such as metal from drilling operations. The IC695ACC310 covers a single empty slot, and there is no need to develop a functioning PACSystem configuration because the IC695ACC310 is not connected to the backplane. The module can be inserted and removed when powered on, however, special attention must be paid to adjacent modules to avoid removal of adjacent modules from the corresponding insertion point. Gaps arise when designing flexible modular systems. Leave space to preserve the strategic arrangement of modules for future modifications and system upgrades. In addition, the IC694ACC310 can be mounted on any PACSystem RX3i rack or baseboard, such as a host rack, extension rack or remote rack. There is no limit to the number of installed instances of IC694ACC310. The IC694ACC310 physical appearance and measurement are typical features of real I/O modules, but the IC694ACC310 slot filler has no LED status indicator and single channel LED indicator. This slot covers module material with I/O module

The same material IC694ACC310 module is a blank slot filled module. The IC694ACC310 module is manufactured by GE Fanuc for the GE RX3i PacSystem, a scalable, high-performance control system that supports PacSystems engines. The system is rack-based and built according to PCI standards. RX3i PacSystems features include Profinet for real-time I/O control, Proficy Machine Edition software for developing and configuring control functions, PacMotion controller for machine automation, and hot standby redundancy control. The RX3i Pacsystems baseboards are available in 16, 12, and 7 slot configurations, and they support hot-swappable functionality to reduce downtime. Expansion baseboards are available in 10 - and 5-slot versions. The IC694ACC310 module is mainly used for cosmetic purposes.

The GE Fanuc IC694ACC310 is a Type B slot filling module manufactured by GE RX3i PacSystem. The GE RX3i PacSystem is a high-performance control system consisting of modules that support the PacSystem engine. This rack-based system is built on the PCI standard and provides fast, consistent control between modules.

The empty IC694ACC310 module is primarily used for decorative purposes and is a placeholder or filler on the rack-based systems of the GE RX3i PacSystem. Modules can be filled with multiple blank slots on a single rack to form a complete module rack. The filling module can be used to protect the active module from damage and prevent the active module from moving out of the frame in the event of a crash or drop.

By filling empty slots on the rack, the IC694ACC310 protects the slots from damage if liquid scratches or spills occur on the rack. If a single slot module is damaged, the electronics of the damaged module can be removed from the case and placed in the IC694ACC310 to restore full operation.

Other modules included in the GE RX3i PacSystem include temperature control module, thermocouple, I/O module, resistance I/O module, local and remote I/O expansion module, pneumatic module, power measurement module, coprocessor communication module, serial communication module, strain gauge I/O module, RTD I/O Modules, millivolt I/O modules, analog hybrid I/O modules (input and output), discrete I/O modules for personal computing systems, and reflective memory interface modules.

GE IC694ACC310 插槽填充模块 高性能控制系统

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